Our electronic component testing processes are genereated by a Components Test Laboratory which is certified as ISO 9001:2008 and certified as a A S9100-C complaint organisation.

Especially for Electronic Components, we provide Visual and Electrical Tests for free to our customers. In general, we are also able to do the following common testing services that we often handle, as follows:


Incoming Inspection

In order to make sure all ordered parts are not damaged during shipping, we always do an inspection on the outer packaging materials. This process includes checking ESD (Electrostatic Discharge) protection, the HIC (Humidity indicator card), passed H20 test and correct MSL (Moisture Sensitivity Level) packaging. Furthermore, we also examine all crucial documentation and certification to the product.

AC/DC Electrical

This includes various tests wich are verifying electrical operating conditions of active and passive components on various types of components from DC limited function to full DC/AC function. We are able to stimulate test conditions depending on industry compliance requirements.

Visual Inspection

This inspection involves a verification of the characteristics of products in order to evaluate their quality and originality so that we can avoid counterfeit products. This inspection includes checking components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.

Solder Testing

We are also able to provide a solder testing to verify that the solder ability of lead components will meet the requirements established according to the standard. This solder testing will determine that storage/environmental conditions have had no adverse effect (oxidation) on the ability to solder components to an interconnecting substrate.

Decapsulating Testing

In order to ensure that the ordered parts is produced by the original manufacturer, we do decapsulation tests for our customers. This destructive test will reveal the die, and characteristics such as die markings, metalization damage because of ESD or corrosion will be inspected.

Ex-Ray Inspection

To verify whether or not parts are counterfeit, the structure of the die can be compared to a known good device. This X-ray inspections include non-destructive tests to inspect the bond wire connections, die size comparison and ESD damaged. X-ray are usually generated base on AS5553 and MIL-STD-883 2012.7.

  Note: If you need other specific tests for most types of your electronic components that are not listed in our lists above, you just contact us and we can arrange based on your needs and requests.